Chemical Vapor Deposition is a chemical technology prepared from high-purity, high-performance solid materials.
Low pressure chemical vapor deposition (LPCVD) is a chemical vapor deposition technology that uses heat to initiate a reaction of a precursor gas on the substrate surface. This reaction at the surface is what forms the solid phase material. Low pressure (LP) is used to reduce of gas phase reactions, and also increases the uniformity across the substrate. Moreover, this process depend on temperature control with the higher the process temperature, the better the maintainability. Comparing to the conventional CVD processes at atmosphere pressure, the advantages of LPCVD are more wafers is loaded per a batch process, the thickness within-wafer uniformity has been improved
For SYSKEY's system can control the gas and real time record system data (pressure, substrate temperature), can perfectly produce
high-quality thin films.
|Configurations and benefits