An ultra high-vacuum (UHV) E-beam deposition system is characterized by pressures lower than 10^-8 ~10^-12 Torr and it is common in chemistry, physics, and engineering. UHV environment is very important to scientific research, because experiments often require surfaces to be maintained in a contamination-free state for the duration of the process and use of low energy electron and ion-based experimental techniques without undue interference from gas phase scattering.In the ultra-high vacuum environment E-beam system, SYSKEY can perfectly produce high-quality thin films.

 

 

 

 

 

Design the substrate rotary coating mechanism for ultra-high vacuum and high temperature heating, use ceramic Palin rotation, and do a water cooling cycle inside to protect the mechanism to make sure the stability of long-term operation.

 

 

 

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Applications	Chamber
Optoelectronic material (LED/Laser Diode). Communication device. Semiconductor device.	Flexible chamber sizes depend on substrate size and applications. Chamber metal sealing and heater backing to 150℃. Ultimate vacuum of chamber about 10-10 Torr.
Configurations and benefits	Options
Flexible substrate size up to 8 inch wafer in diameter. Excellent thin-film uniformity of less than ±3%. Multi-pocket rotary e-beam sources (1/2/4/6 crucibles) with water cooled crucible. Auto deposition rate control. Multiple sources with sequential operation or co-deposition. Substrate holder-cooling (nitrogen liquid down to -70°C) or heating (up to 800°C).	Intergrated with Load-Lock, robot arm, glove box. Combined with ion-source, sputter gun, E-beam, plasma cleaning or assisted.