Metal Thermal

Thermal evaporation system is the most common method of Physical Vapor Deposition (PVD). It is one of the simplest forms of PVD. The evaporation source using electric heating can be used to deposit most organic and inorganic thin films, among which the resistance Joule method is the most common. The advantage of these evaporation sources is that they can provide a simple method of thin film deposition, and current flows through the resistance element that needs to deposit material, thereby heating the material.

When the temperature is heated so that the vapor pressure of the deposited material exceeds the temperature of the vacuum chamber, the material will begin to evaporate and deposit onto the substrate. For SYSKEY's system can control the evaporation rate, the film thickness and uniformity is less than +/- 3%.




Ion source can be used to clean and accelerates the vaporized coating material, and the ion source helps deposit and compact the deposited films during the material deposition process.





Applications Chamber
  • Metal materials research.
  • Nano film.
  • Solar-cell.


  • Flexible chamber sizes depend on substrate size and applications.
  • Full-width opening door integrated two viewports with shutters for observing substrate and thermal sources.
  • Ultimate vacuum of chamber about 10-8 Torr.
Configurations and benefits Options
  • Flexible substrate size up to 12 inch wafer in diameter or 470 x 370 mm2 glass.
  • Full-width opening door (HV chamber) integrated two viewports with shutters for observing substrate and evaporation sources.
  • Excellent thin-film uniformity of less than ±3%.
  • Multiple sources with sequential operation or co-deposition.
  • Substrate holder heating up to 800°C.
  • Substrate rotation can improve thickness uniformity.
  • Adjustable substrate to evaporation source spacing.
  • Shutters are installed each evaporation source and substrate.
  • ​Intergrated with Load-Lock, robot arm, glove box.
  • Combined with Ion-source, for plasma cleaning or assisted deposition.
  • Substrate cooling.
  • Residual gas analy.




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