E-Beam Evaporation System

SYSKEY's electron beam deposition is a practical and highly reliable system. Our system can use a single large crucible for mass production, or multiple crucibles to achieve a multilayer film structure. We support semiconductor research and large equipment design. Planetary rotation design for single and multi-substrate can control the evaporation rate, the film thickness and uniformity is less than +/- 3%.

For the greatest process flexibility, an ion source can be integrated for Ion assisted deposition or pre-clean.

Applications Chamber
  • Optoelectronic material (LED/Laser Diode).
  • Communication device.
  • Semiconductor device.


  • Constructed from 304 stainless steel water cooled via external welding stainless steel 304.
  • Full-width opening door (HV chamber) integrated two viewports with shutters for observing substrate and evaporation sources.
  • Ultimate vacuum of chamber about 10-8 Torr.
Configurations and benefits Options
  • Flexible substrate size up to 12 inch wafer in diameter.
  • Single wafer or multi wafers(2”x 32 pcs, 4”x 16pcs, 6”x 6pcs, 8”x 4pcs).
  • Excellent thin-film uniformity of less than ±3%.
  • Multi-pocket rotary e-beam sources (1/2/4/6 crucibles) with water cooled crucible.
  • Auto deposition rate control.
  • Multiple sources with sequential operation or co-deposition.
  • Substrate holder-cooling (nitrogen liquid down to -70°C) or heating (up to 800°C).
  • Intergrated with Load-Lock, robot arm, glove box.
  • Combined with ion-source, sputter gun, E-beam, plasma cleaning or assisted.















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