Products

Sputtering System

Description
  • Substrate Size: up to 12”
  • Thickness uniformity: <±3%
  • 10-10 Torr Ultimate vacuum
  • Substrate heating up to 1000˚C
  • HV and UHV available
  • Custom Design available
  • Fully Safety Interlocked
  • Single, multi-layer or co-deposition
  • Full automatic control system with touch screen display
  • Real time record system data (pressure, substrate temperature, deposition rate)
  • Real time process control to provide precise film quality and film reliability
  • Multiple levels of access with password protection
  • Choice of Turbo/Cryo/Diffusion Pump available
  • Extra spare port for OES, RGA or extra process monitoring
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Options

  • Load-Lock and auto wafer load unload
  • RF or DC bias
  • Thickness Monitor
  • Substrate RF Plasma Cleaning
  • Ion-source
  • Residual Gas Analyzer
  • Connect with Glove box

Applications

  • Semiconductors
  • Nanotechnology
  • TCO (ITO, ZnO, AZO, GZO, IZO, IGZO etc)
  • Oxide, Nitride and Metal materials research
  • Solar-cell
  • Optical